Solder dot span receives head stress meet an emergency to distributing to glue solder the influence with intensity

The shape size sheet of 1 connect lists much solder to nod glue solder the over all dimension of lap joint is shown 1 times like the graph. Test specimen two end bear even drawing cuts load. Mother capable person uses deep strong board for 08Al car, wide 40mm, thick 1mm. To inspect adhesive flexibility at the same time the model measures the effect that distributings to meet an emergency of the stress in contact, the epoxy resin that used amount of high stretch standard base adhesive and the acrylic ester adhesive that low stretch standard measures, sub ply is 0.

4mm. Contact overlap length is 40mm, the solder dot of diametical 5mm is arranged to equidistance along Y. This research chooses solder to nod span A to be 10mm, 20mm, 30mm, 40mm and 50mm 5 kinds, the stress meet an emergency in studying connect of solder of two kinds of glue distributings. Graph the figure that 1 sheet lists much solder to nod glue solder test specimen and dimension (Mm)1.

Of 2 connect finite yuan reseau differentiates to the graph a shown much solder nods glue solder connect, when test specimen Y to very long when, action is cut to fall in even drawing, each solder dot gets force case in contact identical, nod the linear semmetry about X direction as a result of some solder at the same time, need to consider among them in part only so can. Graph 2 gave out what solder nods the test specimen when span A=40mm is finite yuan reseau differentiates circumstance, right now reseau Y is 20mm to overall width. Use three-dimensional 8 node piece unit, on, below board reach sub is equational make two, solder dot and overlap brim are in reseau fractionize, the smallest size is in reseau 0.

15mm. Made to test specimen of glue solder connect in the analysis simplify appropriately, think structural join is in good condition, on sub and interface of union of mother capable person nonexistent blemish, also do not have plan the influence that enters electrode impress. The mechanical performance that solder considered to select an area in computational model is uneven quality, think frit nucleus and mother capable person have different mechanical property, because limits of hot influence area is lesser, assume its have as same as frit nucleus mechanical function in computation. The rank of mechanical performance data in computational model is expressed 1. Use what curve of bilinear stress meet an emergency depicts material to play plasticity function. Use ALGOR nonlinear finite yuan of structural analysis program, calculated the field of stress meet an emergency in each connect leaves in action of 135MPa name stress. Graph of 2 test specimen finite yuan reseau differentiates (A) whole is finite yuan of reseau; (B) overlap is finite yuan of reseau watch 1 finite yuan of mechanical property that data uses in the analysis the stress meet an emergency of connect of 2 glue solder distributings 2.

1 epoxy resin base the computation of glue solder connect of adhesive makes clear as a result, the close of stress meet an emergency in connect of solder of the glue below span of dot of 5 kinds of solder, to be clear about for the purpose of, give out only A=10mm, 30mm and 50mm the stress meet an emergency of 3 kinds of circumstances distributings. Graph when the 3 epoxy resin adhesive that measure to introduce tall stretch model, near the armor plate in 3 kinds of connect and sub union scale, meet an emergency of the stress in sub is in X just distributings to what go up. Graph the epoxy resin of span of dot of 3 different solder base the stress meet an emergency in overlap of connect of adhesive glue solder distributings (A) stress; (B) shearing stress; (C) meet an emergency; (D) cut meet an emergency by the overlap in graph 3a stress σ X is in of X direction distributing knowable, in the connect of span of dot of 3 kinds of solder, the distributinging trend of stress is basic and same. In sub of outclass of stress of solder place area stress, solder drop edge is done not have stress concentration solder chooses a center stress is highest; The stress in sub distributings basically equably, in overlap place of predestined relationship of or so both sides rises somewhat. Nod the addition of span as solder, solder dot is in-house stress is reduced somewhat, in sub stress value is basic indeclinable. τ Zx is in graph 3b shearing stress of X direction distributing make clear, the solder in each connect nods brim existence shearing stress to center, right predestined relationship is drawing shearing stress peak, left predestined relationship is reduce shearing stress peak; The shearing stress of overlap sub shows the margin big, mid small distributinging current, near predestined relationship of both sides of overlap left and right sides area, shearing stress is worth the biggest. The drawing on solder drop edge and compress shearing stress to peak value nods the accretion of span along with solder and be reduced somewhat; The accretion that the highest shearing stress near overlap brim nods span along with solder is basic and changeless. of X of ε of meet an emergency if graph 3c place is shown,distributing. Can see from which, in whole overlap meet an emergency is very small. Should greatening to select an area at solder in sub, on the right side of overlap of sub prep above of meet an emergency is left. Standing by solder to order the sub part of the brim and overlap brim, cost of meet an emergency is higher, near overlap right predestined relationship value of meet an emergency is highest. What overlap brim is in is the biggest meet an emergency nods the addition of span along with solder and increasing somewhat. Graph 3d is those who cut Zx of ε of meet an emergency to distributing. Cut meet an emergency to be worth apparent prep above it is thus clear that value of meet an emergency. Meet an emergency is cut to show in overlap mid the distributinging trend with small, big edge, make clear cut meet an emergency to basically distributing in sub area, solder place area cuts meet an emergency very small, solder nods the brim to did not cut concentration of meet an emergency, solder nods interior to cut meet an emergency to distributing equably. Solder nods span A to increase 50mm from 10mm, overlap cuts distributinging trend of meet an emergency not to produce a change, the shears of overlap brim sub value of meet an emergency increases somewhat. This one analysis makes clear, when using high stretch standard to measure adhesive, solder increases to nod span inside 10 ～ 50mm, stress of solder place area is reduced somewhat and the stress meet an emergency in overlap brim sub lifts somewhat only, can not reduce the carrying capacity of contact apparently. Use bigger solder to nod span to reduce solder check the number to measure right now, mix to section report raise productivity to have active sense. 2.

Adhesive of 2 acrylic ester glue solder connect pursues 4 measure adhesive to introduce low stretch model, solder nods span to be 10mm, near the armor plate in 3 kinds of connect of 30mm and 50mm and sub union scale, meet an emergency of the stress in sub is in X just distributings to what go up. Graph the acrylic ester adhesive of span of dot of 4 different solder the stress meet an emergency in overlap of glue solder connect distributings (A) stress; (B) shearing stress; (C) meet an emergency; (D) cut meet an emergency by graph 4a of stress σ X distributing can see, with quantity of high stretch standard adhesive glue solders the head is similar, solder point point is put in Gaozheng stress, in sub stress is very little; Different is, right now solder drop edge is in existence stress concentration, right predestined relationship is drawing stress peak, left predestined relationship is compress stress peak. Solder nods brim stress to peak value nods the accretion of span along with solder and increase, in sub stress does not order the change of span basically along with solder and changing. The shearing stress in overlap of τ Zx if graph 4b place is shown,distributing. Shearing stress basically also distributings to select area at solder, the shearing stress in sub is close to Yu Ling. Solder nods both sides predestined relationship to be in shearing stress to center, peak value is close to two shearing stress. Solder dot interior and the shearing stress that solder nods the brim nod the addition of span along with solder and increase, the shearing stress in sub does not order the change of span basically along with solder and change. of X of ε of meet an emergency if graph 4c place is shown,distributing. Solder drop edge is in existence concentration of meet an emergency, right predestined relationship is drawing meet an emergency, left predestined relationship is compress meet an emergency. Drawing of place of solder drop edge and compress peak value of meet an emergency nods the addition of span along with solder and increasing. In sub of overlap right predestined relationship meet an emergency is midder than overlap in sub slightly tall, the accretion that value of meet an emergency nods span along with solder is basic and changeless. Zx of ε of meet an emergency cuts to go up in X direction in graph 4d distributing make clear, overlap cuts meet an emergency to basically distributing in sub, solder point point cuts meet an emergency the value is far meet an emergency is cut in be less than sub, cut meet an emergency to nod interior to distributing basically equably in solder. The shears inside sub meet an emergency nods the brim to increase gradually to overlap brim from solder, achieve in overlap brim place the biggest. The shears in whole overlap sub meet an emergency nods the accretion of span along with solder and increase. See from afore-mentioned analysises, when the acrylic ester adhesive that uses amount of low stretch standard, stress, shearing stress is in concentration in solder dot, stress volume intermediate range spends the dot that follow solder to increase and increase of span; The shears in overlap brim sub value of meet an emergency also nods the addition of span along with solder and increase. Acrylic ester adhesive basically has solder dot to shoulder load in glue solder connect, solder nods span to increase, corresponding and identical board of broad check the number issueing solder reduce, inevitable meeting increases solder to nod the stress value of place; At the same time the stiffness of glue solder connect also nods along with solder decrease and reduce, contact is fought be out of shape ability is reduced, cut meet an emergency to increase. Have adverse effect to the intensity of contact. The experiment research that 3 sheet list much solder to nod glue solder connect nods span to list much solder to nod glue solder connect to sheet to inspect solder the influence of mechanical sex, inspect the effectiveness of numeric analysis at the same time, use CSS-1110 electron universal test machine had static drawing shear test, the experiment undertakes below room temperature, to load rate is 5mm/min. Solder nods span A to be 20mm respectively, 30mm and 40mm. Each test specimen all contains 3 solder feature, y of corresponding test specimen is 60mm respectively to length, 90mm and 120mm. The peak value of the first load that the sub of each connect correspondence that the experiment obtains ruptures is shown at graph 5a. Apparent, because solder nods span big contact width is big, rupture so load is high. It is the influence of oversight board wide element, graph 5b gave out the N of nominal stress σ when contact ruptures and the concern that solder orders span, among them definition of N of nominal stress σ is: The P F in type of σ N =Pf/I*t is rupture load, I is board wide, t is board thick. Can see from inside graph 5b, the nominal stress when contact ruptures nods the addition of span along with solder and reduce somewhat. Hills [6] also studied what a variety of solder nod weldment of the glue when span and different solder check the number to rupture behavior, the test specimen of check the number of different to identical width solder has a test. The result makes clear, when using high stretch standard to measure adhesive, of contact sub portion rupture load increases along with the addition of solder check the number, the nominal stress when sub happening ruptures nods span to reduce along with solder and increase namely, when using low stretch standard to measure adhesive, this one effect is more apparent. The test result of this one conclusion and our earning is consistent, calculate result income from numerical value plan with us at the same time forecast consistent also, showed the validity of computational result. Visible, finite yuan of numeric analysis method is mechanical to studying head of geometrical parameter butt joint the influence of behavior is a kind of effective method. Graph when 5 different solder nod the sub below span rupture load and nominal stress (A) rupture load and the concern that solder orders span; (B) rupture nominal stress and the concern that solder orders span 4 conclusion (1) when using high stretch standard to measure adhesive, solder increases to nod span inside 10 ～ 50mm, stress of solder place area is reduced somewhat and the stress meet an emergency in overlap brim sub lifts somewhat, increase solder to nod span, the carrying capacity that reduces contact, but range is not big. (2) when the acrylic ester adhesive that uses amount of low stretch standard, solder dot is in existence stress to center, stress volume intermediate range spends the dot that follow solder to increase and increase of span; The shears in overlap brim sub value of meet an emergency also nods the addition of span along with solder and increase. Solder dot span increases make bear the weight of solder check the number decreases, contact stiffness is reduced, intensity of butt joint head has adverse effect, higher than using stretch standard measures this one effect when adhesive more remarkable. (3) use epoxy resin base solder nods the Chanlieduo of adhesive in contact, sub most rupture first. Solder nods the glue solder test specimen with big span, because test specimen width is big, its rupture load is high, but the nominal stress when contact ruptures nods the addition of span along with solder and reduce somewhat. (4) the influence rule of intensity of head of butt joint of span of dot of experiment earning solder and the pattern that numerical value analyses the place on the foundation to forecast are consistent, proved to use the validity that numeric calculation method has mechanical behavior forecasts contact. CNC Milling CNC Machining